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FF-5100 Non-cyanide Alkaline Copper Plating Chemicals for Fast Deposition and Stable Process in Electroplating

FF-5100 Non-cyanide Alkaline Copper Plating Chemicals for Fast Deposition and Stable Process in Electroplating

  • Evidenziare

    Fast Deposition Copper Plating Chemicals

    ,

    Stable Process Electroplating Copper Plating Chemicals

    ,

    Environment Friendly Chemical Auxiliary Agent

  • Tipo
    Proiettore
  • Articolo
    Agente ausiliario chimico
  • Utilizzo
    Ramatura
  • Caratteristica
    Deposito veloce, processo stabile
  • caratteristica
    Non contenenti cianuro
  • Nome
    Prodotti chimici per il rivestimento del rame mediante elettroplatazione
  • Luogo di origine
    Cina
  • Marca
    FENGFAN
  • Numero di modello
    FF-5100
  • Quantità di ordine minimo
    Negoziabile
  • Prezzo
    Negoziabile
  • Imballaggi particolari
    Packaging di esportazione standard
  • Tempi di consegna
    15-25 giorni di lavoro
  • Termini di pagamento
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Capacità di alimentazione
    200000pcs/giorno

FF-5100 Non-cyanide Alkaline Copper Plating Chemicals for Fast Deposition and Stable Process in Electroplating

FF-5100  Non - cyanide alkaline copper plating process


FF-5100 Non - cyanide alkaline copper plating is environment friendly, which can meet the environmental requirements of the electroplating industry .

 

1. Features

1.1   Non-cyanide, suitable for direct copper plating for iron and steel substrate, also suitable for aluminum alloy and zinc alloy.

1.2   Has excellent dispersion and coverage, coating fine, smooth, soft and a certain brightness.

1.3   Single component supplement, simple operation , wide temperature range, can be at 40 ~ 50 .

1.4   Coating surface is not hydrophobic, without removing the film, can be directly plated with nickel or other metals.

 

2. Solution composition and process parameters

2.1 Process Flow:

Pre-treatment washing washing acide activation washing washing copper plating(FF-5100) Washing   Post-processing

 

2.2 composition of plating solution  

 

composition

range

optimal

FF-5100 M

400~600ml/L

500 ml/L

Temperature

40~55

50

PH

9~10

9.5

Cathode current density

1.0~3.0 A/dm2

2.0 A/dm2

Cathode current density(barrel plating)

0.5~2.0 A/dm²

1.0 A/dm²

Anode

Electrolytic copper

Electrolytic copper

Anode area: cathode area

1:1

11~2

Filter

continuous

continuous

Agitate

Air or mechanical agitation

Air  agitation